1) 3D high speed soldering checkout device
2) white light
Port: Shenzhen
Minimum Order Quantity: 1 Set/Sets
Payment Terms: T/T
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3D high speed soldering checkout device
Measurement Principle | 3D white light PSLM PMP |
Measurements | volume,area,hight,XY,shape |
FOV size | 26×20mm(1.02×0.75 in.) |
Accuracy | XY:10μm(0.39mils); Hight:±1μm(±0.04mils) |
Repeatability | Hight:<1μm(4 Sigma), area:<1%(5 Sigma) |
Detection Speed | <1.5s/FOV |
Mark-point detection time | 1s/pcs |
Maximum Measuring height | 700μm(27.5 mils) |
Maximum Measuring height of PCB warp | ±5mm (0.20 in.) |
Minimum pad spacing | 100μm(3.94 mils) (solder paste hight 150μm) |
Smallest size measurement | rectangle:150μm(5.9 mils), circle:200μm(7.87 mils) |
Maximum PCB Size | 350×250mm(13.8×9.8 in.) 460x350mm,710x650mm |
Engineering Statistics | Histogram, Xbar-R Chart, Xbar-S Chart,Cp & Cpk, % Gage Repeatability Data,SPI Daily/Weekly/Monthly Reports |
Read position Detection | supportGerber Format(274x, 274d) Teach |
Operating system support | WindowsXP Professional&windows7 professional |
Equipment Dimensionandeight | 750×680×500 mm(30×27×20 in.) 75kg |